Batch-type plasma reflow device (flux reflow)
Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.
Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.
- Company：神港精機 東京支店
- Price：Other
